Recently, SEMI released a report stating that it is expected that the global 300 mm semiconductor fab production capacity will reach a new high in 2025.

According to SEMI's report, global semiconductor manufacturers are expected to expand the capacity of 300mm fabs with a compound average growth rate (CAGR) of nearly 10% from 2022 to 2025, reaching a record high of 9.2 million wafers per month.

From the perspective of various regions, the global share of the capacity of 300mm front-end fabs in Chinese mainland will increase from 19% in 2021 to 23% in 2025, reaching 2.3 million wpm (monthly capacity, 8-inch chips). With this growth, the production capacity of 300mm fabs in Chinese mainland will be close to that in South Korea, and it is expected to surpass that in Taiwan Province, China next year.

SEMI predicts that from 2021 to 2025, the share of global production capacity in Taiwan Province, China will decrease by 1%, accounting for 21%, while the share of South Korea will also decrease slightly by 1% to 24% in the same period. As the competition with other regions intensifies, Japan's share will drop significantly, from 15% in 2021 to 12% in 2025. In addition, the global share of 300mm fabs in the United States will increase slightly, from 8% in 2021 to 2025.